JPH0187578U - - Google Patents
Info
- Publication number
- JPH0187578U JPH0187578U JP18488787U JP18488787U JPH0187578U JP H0187578 U JPH0187578 U JP H0187578U JP 18488787 U JP18488787 U JP 18488787U JP 18488787 U JP18488787 U JP 18488787U JP H0187578 U JPH0187578 U JP H0187578U
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- printed
- conductive paste
- printed circuit
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000007547 defect Effects 0.000 claims 2
- 239000000919 ceramic Substances 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18488787U JPH0187578U (en]) | 1987-12-03 | 1987-12-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18488787U JPH0187578U (en]) | 1987-12-03 | 1987-12-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0187578U true JPH0187578U (en]) | 1989-06-09 |
Family
ID=31699770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18488787U Pending JPH0187578U (en]) | 1987-12-03 | 1987-12-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0187578U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024241755A1 (ja) * | 2023-05-23 | 2024-11-28 | 富士フイルム株式会社 | 基板製造方法 |
-
1987
- 1987-12-03 JP JP18488787U patent/JPH0187578U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024241755A1 (ja) * | 2023-05-23 | 2024-11-28 | 富士フイルム株式会社 | 基板製造方法 |